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Ultramid® T 4381 LDS SW23271

Ultramid® T 4381 LDS SW23271

Manufacturer: BASF
Produced At:
 Europe / China
Product Category: Polyamide 6/6T
Product No: Ultramid T 4381 LDS SW23271
Product Quantity: 25KG / BAG
Product Features: Aromatic
CopolymerGood StiffnessGood StrengthGood ToughnessLow to No Water Absorption10% Glass Fiber,25% Mineral

Ultramid® T 4381 LDS SW23271
Polyamide 6/6T Copolymer
Product Description:
Glass fibre and mineral reinforced partially aromatic polyamide for injection moulding. Good toughness, stiffness and strength, low water absorption, high melting point (295 °C). The product is especially tailored for laser direct structuring (LDS). The structured areas can be metallized selectively.
Physical
Dry
Conditioned
Unit
Test Method
Density
1.57
--
g/cm³
ISO 1183
Molding Shrinkage



ISO 294-4
Across Flow
0.80
--
%

Flow
0.60
--
%

Water Absorption



ISO 62
Saturation, 73°F
4.2 to 5.2
--
%

Equilibrium, 73°F, 50% RH
0.80 to 1.2
--
%

Viscosity Number (96% H2SO4 (Sulphuric Acid))
130
--
cm³/g
ISO 307
Mechanical
Dry
Conditioned
Unit
Test Method
Tensile Modulus
1.31E+6
--
psi
ISO 527-2
Tensile Stress (Break)
16000
--
psi
ISO 527-2
Tensile Strain (Break)
2.0
--
%
ISO 527-2
Impact
Dry
Conditioned
Unit
Test Method
Charpy Unnotched Impact Strength



ISO 179/1eU
-22°F
17
--
ft·lb/in²

73°F
17
--
ft·lb/in²

Thermal
Dry
Conditioned
Unit
Test Method
Heat Deflection Temperature (66 psi, Unannealed)
509
--
°F
ISO 75-2/B
Melting Temperature
563
--
°F
ISO 11357-3
CLTE



ISO 11359-2
Flow : 73 to 176°F
1.7E-5
--
in/in/°F

Transverse : 73 to 176°F
2.8E-5
--
in/in/°F

Electrical
Dry
Conditioned
Unit
Test Method
Volume Resistivity
> 1.0E+15
1.0E+14
ohms·cm
IEC 60093
Relative Permittivity (1 MHz)
4.40
4.20

IEC 60250
Dissipation Factor (1 MHz)
0.015
0.038

IEC 60250
Comparative Tracking Index(Solution A)
600
--
V
IEC 60112
Flammability
Dry
Conditioned
Unit
Test Method
Flammability Classification (0.06 in)
HB
--

IEC 60695-11-10, -20


Products are widely used in plastic modification, automotive, construction, electrical and electronic, industrial, daily necessities and other fields


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